Patent Assignment
Reel/Frame 020539/0399
Assignment of Assignor's Interest
Recorded: 2008-02-06
Pages: 2
Assignors
FANG, CHING MENG
Executed: 2008-01-09
CHOW, KIN YEAN
Executed: 2008-01-09
MANDEL, LARRY M.
Executed: 2008-01-25
YONG, SIM YING
Executed: 2008-01-09
Assignee
DELPHI TECHNOLOGIES, INC.
LEGAL STAFF - MAIL CODE: 480-410-202, P.O. BOX 5052, TROY, MICHIGAN
Covered Property
(1)
Overmolded Electronic Assembly with Metal Seal Ring
Patent:
7,455,552 →
Application:
12/069,036 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 13, 2009
From: DELPHI TECHNOLOGIES, INC.
To: BANK OF NEW YORK MELLON, AS ADMINISTRATIVE AGENT, THE
Reel/Frame 023510/0562 →
Release of Security Interest
Apr 15, 2011
From: THE BANK OF NEW YORK MELLON
To: DELPHI CONNECTION SYSTEMS HOLDINGS LLC; DELPHI PROPERTIES MANAGEMENT LLC; DELPHI TECHNOLOGIES, INC.; DELPHI AUTOMOTIVE SYSTEMS LLC
Reel/Frame 026138/0574 →
Security Agreement
Apr 18, 2011
From: DELPHI TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 026146/0173 →
Release of Security Interest
Jan 14, 2015
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 034762/0540 →
Assignment of Assignor's Interest
Jan 23, 2018
From: DELPHI TECHNOLOGIES, INC
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 045113/0958 →
Change of Name
Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068985/0968 →