Patent Assignment
Reel/Frame 020563/0284
Assignment of Assignor's Interest
Recorded: 2008-02-19
Pages: 3
Assignors
MORI, KENICHI
Executed: 2008-02-12
MAEKAWA, KAZUYOSHI
Executed: 2008-02-12
AMO, NORIAKI
Executed: 2008-02-12
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO 100-0004, JAPAN
Covered Property
(1)
Semiconductor device having at least two layers of wirings stacked therein and method of manufacturing the same
Application:
12/071,200 →
Publication:
US 2008/0197496
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.