Patent Assignment
Reel/Frame 020572/0701
Assignment of Assignor's Interest
Recorded: 2008-02-27
Pages: 3
Assignor
SASAKI, TAKAOKI
Executed: 2008-02-14
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device and Semiconductor Device