IP Library Assignment 020598/0602
Patent Assignment
Reel/Frame 020598/0602

Assignment of Assignor's Interest

Recorded: 2008-03-04 Pages: 2
Assignors
NI, JIM CHIN-NAN
Executed: 2008-03-03
MA, ABRAHAM C.
Executed: 2008-03-03
HSUEH, PAUL
Executed: 2008-03-03
Assignee
SUPER TALENT ELECTRONICS, INC.
2079 NORTH CAPITOL AVENUE, SAN JOSE, CALIFORNIA, 95132
Covered Property (1)
Memory Module Assembly Including Heat-Sink Plates with Heat-Exchange Fins Attached to Integrated Circuits by Adhesive
Patent: 7,768,785 →
Application: 12/042,229 →
Publication: US 2008/0151487
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 27, 2014
From: SUPER TALENT ELECTRONIC, INC.
To: SUPER TALENT TECHNOLOGY, CORP.
Reel/Frame 032540/0565 →