IP Library › Assignment 020601/0179
Patent Assignment
Reel/Frame 020601/0179

Assignment of Assignor's Interest

Recorded: 2008-03-04 Pages: 5
Assignors
BINKERT, NATHAN
Executed: 2008-02-28
JOUPPI, NORM
Executed: 2008-03-03
DAVIS, AL
Executed: 2008-03-03
BEAUSOLEIL, RAYMOND
Executed: 2008-02-27
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property (1)
Three-Dimensional Die Stacks with Inter-Device and Intra-Device Optical Interconnect
Patent: 8,064,739 →
Application: 11/977,350 →
Publication: US 2009/0103855
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 9, 2015
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 037079/0001 →