IP Library › Assignment 020634/0365
Patent Assignment
Reel/Frame 020634/0365

Assignment of Assignor's Interest

Recorded: 2008-03-12 Pages: 5
Assignors
SILVERBROOK, KIA
Executed: 2008-03-05
CHUNG-LONG-SHAN, LAVAL
Executed: 2008-03-05
TANKONGCHUMRUSKUL, KIANGKAI
Executed: 2008-03-05
Assignee
SILVERBROOK RESEARCH PTY LTD
393 DARLING STREET, BALMAIN, 2041, AUSTRALIA
Covered Property (1)
Method of Forming Low Profile Wire Bonds Between Integrated Circuits Dies and Printed Circuit Boards
Patent: 7,669,751 →
Application: 12/046,451 →
Publication: US 2009/0078744
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 18, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028581/0721 →
Change of Name Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →