Patent Assignment
Reel/Frame 020649/0869
Assignment of Assignor's Interest
Recorded: 2008-03-06
Pages: 3
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, 105-8460, JAPAN
Covered Property
(1)
Semiconductor Integrated Circuit Production Method and Device Including Preparing a Plurality of Soi Substrates, Grouping Soi Substrates Having Mutual Similarities and Adjusting Their Layer Thicknesses Simultaneously
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.