IP Library › Assignment 020664/0505
Patent Assignment
Reel/Frame 020664/0505

Assignment of Assignor's Interest

Recorded: 2008-03-17 Pages: 2
Assignor
YAMAMOTO, HIROSHI
Executed: 2007-11-12
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, 105-8460, JAPAN
Covered Property (1)
Semiconductor Wafer, Semiconductor Chip and Method of Manufacturing Semiconductor Chip
Patent: 7,755,084 →
Application: 11/856,935 →
Publication: US 2008/0258144
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 22, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022162/0669 →
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →