IP Library Assignment 020700/0552
Patent Assignment
Reel/Frame 020700/0552

Assignment of Assignor's Interest

Recorded: 2008-03-20 Pages: 3
Assignor
NAKAYAMA, AKIRA
Executed: 2008-02-14
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, 105-8460, JAPAN
Covered Property (1)
Cof Package and Tape Substrate Used in Same
Patent: 8,058,713 →
Application: 12/052,172 →
Publication: US 2009/0079047
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 29, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022231/0935 →
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →