Patent Assignment
Reel/Frame 020761/0121
Assignment of Assignor's Interest
Recorded: 2008-04-07
Received: 2008-04-07
Pages: 3
Assignee
MEGICA CORPORATION
ROOM 301, NO. 47, PARK 2ND RD.,, HSINCHU, TWX, 300, TAIWAN
Covered Property
(1)
Low fabrication cost, fine pitch and high reliability solder bump
Application:
12/098,468 →