Patent Assignment
Reel/Frame 020761/0124
Assignment of Assignor's Interest
Recorded: 2008-04-07
Received: 2008-04-07
Pages: 3
Assignor
COHEN, GUY
Executed: 2008-03-09
Assignee
SAIFUN SEMICONDUCTORS LTD.
17 GIBORAY ISRAEL STREET, BUILDING A, SAPIR INDUSTRIAL AREA, NETANYA, ILX, 42504, ISRAEL
Covered Properties
(3)
Low fabrication cost, fine pitch and high reliability solder bump
Application:
12/098,469 →
Low fabrication cost, fine pitch and high reliability solder bump
Application:
12/098,468 →
Method, System and Circuit for Operating a Non-Volatile Memory Array
Application:
12/071,749 →