Patent Assignment
Reel/Frame 020761/0127
Assignment of Assignor's Interest
Recorded: 2008-04-07
Received: 2008-04-07
Pages: 3
Assignee
MEGICA CORPORATION
ROOM 301, NO. 47, PARK 2ND RD.,, HSINCHU, TWX, 300, TAIWAN
Covered Properties
(2)
Low fabrication cost, fine pitch and high reliability solder bump
Application:
12/098,469 →
Mobile Charge Induced Periodic Poling and Device
Application:
12/034,138 →