IP Library Assignment 020788/0192
Patent Assignment
Reel/Frame 020788/0192

Assignment of Assignor's Interest

Recorded: 2008-04-11 Pages: 4
Assignors
ANDERSON, FRANK EDWARD
Executed: 2008-04-10
BERNARD, DAVID LAURIER
Executed: 2008-04-10
DRYER, PAUL WILLIAM
Executed: 2008-04-10
JOYNER, BURTON LEE, II
Executed: 2008-04-10
MCNEES, ANDREW LEE
Executed: 2008-04-10
STRUNK, TIMOTHY LOWELL
Executed: 2008-04-10
SULLIVAN, CARL EDMOND
Executed: 2008-04-10
Assignee
LEXMARK INTERNATIONAL, INC.
740 WEST NEW CIRCLE RD., INTELLECTUAL PROPERTY LAW DEPT., LEXINGTON, KENTUCKY, 40550
Covered Property (1)
Heater Chips with Silicon Die Bonded on Silicon Substrate and Methods of Fabricating the Heater Chips
Patent: 7,938,513 →
Application: 12/101,215 →
Publication: US 2009/0256891
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 14, 2013
From: LEXMARK INTERNATIONAL, INC.; LEXMARK INTERNATIONAL TECHNOLOGY, S.A.
To: FUNAI ELECTRIC CO., LTD
Reel/Frame 030416/0001 →