Patent Assignment
Reel/Frame 020826/0879
Assignment of Assignor's Interest
Recorded: 2008-04-18
Pages: 3
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12 TORANOMON 1-CHOME, MINATO-KU, TOKYO, 105-8460, JAPAN
Covered Property
(1)
Semiconductor manufacturing apparatus, semiconductor wafer manufacturing method using this apparatus, and recording medium having program of this method recorded therein
Application:
12/076,127 →
Publication:
US 2008/0242105
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.