IP Library › Assignment 020835/0090
Patent Assignment
Reel/Frame 020835/0090

Assignment of Assignor's Interest

Recorded: 2008-04-22 Pages: 5
Assignors
LIN, MOU-SHIUNG, MR.
Executed: 2008-04-22
LEE, JIN-YUAN, MR.
Executed: 2008-04-22
Assignee
MEGICA CORPORATION
ROOM 301/302,NO.47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Properties (2)
Post Passivation Interconnection Schemes on Top of the Ic Chips
Patent: 7,439,627 →
Application: 11/861,295 →
Publication: US 2008/0006946
Post Passivation Interconnection Schemes on Top of the Ic Chips
Patent: 7,479,450 →
Application: 11/861,299 →
Publication: US 2008/0009131
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →