Patent Assignment
Reel/Frame 020856/0812
Assignment of Assignor's Interest
Recorded: 2008-04-24
Pages: 2
Assignors
ISHITOBI, TAKASHI
Executed: 2007-02-20
OHTORI, TAKASHI
Executed: 2007-02-20
TANAKA, YASUSHI
Executed: 2007-02-20
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Semiconductor Integrated Circuit Device, Method For Testing The Semiconductor Integrated Circuit Device, Semiconductor Wafer And Burn-In Test Apparatus
Application:
11/661,680 →
Publication:
US 2008/0054260
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.