Patent Assignment
Reel/Frame 020944/0657
Assignment of Assignor's Interest
Recorded: 2008-05-13
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Pad Structure for 3D Integrated Circuit