Patent Assignment
Reel/Frame 020987/0197
Assignment of Assignor's Interest
Recorded: 2008-05-12
Pages: 6
Assignors
KIM, SEONG-GOO
Executed: 2008-04-22
HONG, HYEONG-SUN
Executed: 2008-04-22
KIM, DONG-HYUN
Executed: 2008-04-22
KANG, NAM-JUNG
Executed: 2008-04-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Contact Structures Semiconductor Devices