Patent Assignment
Reel/Frame 021001/0514
Assignment of Assignor's Interest
Recorded: 2008-05-27
Pages: 2
Assignors
HIRATA, TATSUYA
Executed: 2007-12-14
TANAKA, SHOUZI
Executed: 2007-12-14
MIYAGAWA, RYOHEI
Executed: 2007-12-14
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Solid-State Imaging Device Having Wiring Layer Which Includes Lamination of Silicide Layer in Order to Reduce Wiring Resistance, and Manufacturing Method for the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.