Patent Assignment
Reel/Frame 021028/0541
Assignment of Assignor's Interest
Recorded: 2008-06-02
Pages: 2
Assignors
UEDA, YOJI
Executed: 2008-01-29
SHIRAISHI, TSUKASA
Executed: 2008-01-29
HAYASHI, YOSITAKE
Executed: 2008-01-29
OKIMOTO, RIKIYA
Executed: 2008-01-29
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Test Mark Structure, Substrate Sheet Laminate, Multilayered Circuit Substrate, Method for Inspecting Lamination Matching Precision of Multilayered Circuit Substrate, and Method for Designing Substrate Sheet Laminate
Application:
12/023,144 →
Publication:
US 2008/0186045
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.