Patent Assignment
Reel/Frame 021043/0833
Assignment of Assignor's Interest
Recorded: 2008-06-03
Pages: 2
Assignors
SUZUKI, NAOKI
Executed: 2008-02-12
NAKAHASHI, AKIHISA
Executed: 2008-02-12
MAEGAWA, YUKIHIRO
Executed: 2008-02-05
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Semiconductor Chip Mounting Substrate, Semiconductor Chip Mounting Body, Semiconductor Chip Stacked Module, and Semiconductor Chip Mounting Substrate Manufacturing Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.