Patent Assignment
Reel/Frame 021046/0043
Assignment of Assignor's Interest
Recorded: 2008-05-30
Pages: 2
Assignee
ASM ASSEMBLY AUTOMATION LTD
20/F., WATSON CENTRE, 16-22 KUNG YIP ST., KWAI CHUNG, HONG KONG, CHINA
Covered Property
(1)
Method of Bonding Semiconductor Devices Utilizing Solder Balls
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.