Patent Assignment
Reel/Frame 021052/0236
Assignment of Assignor's Interest
Recorded: 2008-06-05
Pages: 2
Assignor
FUTASE, TAKUYA
Executed: 2008-03-07
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Manufacturing Method of Semiconductor Device Including Filling a Connecting Hole with Metal Film
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger
Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →