Patent Assignment
Reel/Frame 021089/0212
Assignment of Assignor's Interest
Recorded: 2008-06-12
Pages: 4
Assignors
OKUDO, TAKAFUMI
Executed: 2008-05-27
SUZUKI, YUJI
Executed: 2008-05-27
TAKEGAWA, YOSHIYUKI
Executed: 2008-05-27
BABA, TORU
Executed: 2008-05-27
GOTOU, KOUJI
Executed: 2008-05-27
MIYAJIMA, HISAKAZU
Executed: 2008-05-27
KATAOKA, KAZUSHI
Executed: 2008-05-27
SAIJO, TAKASHI
Executed: 2008-05-27
Assignee
MATSUSHITA ELECTRIC WORKS, LTD.
1048, OAZA-KADOMA, KADOMA-SHI, OSAKA, 571-8686, JAPAN
Covered Property
(1)
Wafer Level Package Structure, and Sensor Device Obtained from the Same Package Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.