IP Library › Assignment 021093/0546
Patent Assignment
Reel/Frame 021093/0546

Assignment of Assignor's Interest

Recorded: 2008-06-12 Pages: 3
Assignors
LEE, JAE-SEOB
Executed: 2008-06-09
KWACK, JIN-HO
Executed: 2008-06-09
AHN, TAE-KYUNG
Executed: 2008-06-09
Assignee
SAMSUNG SDI CO., LTD.
575 SHIN-DONG, YEONGTONG-GU, SUWON, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Flexible Substrate Bonding and Debonding Apparatus
Patent: 8,376,017 →
Application: 12/138,313 →
Publication: US 2008/0308231
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 10, 2008
From: SAMSUNG SDI CO., LTD.
To: SAMSUNG MOBILE DISPLAY CO., LTD.
Reel/Frame 022552/0192 →
Merger Aug 31, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028921/0334 →