Patent Assignment
Reel/Frame 021107/0674
Assignment of Assignor's Interest
Recorded: 2008-06-17
Pages: 2
Assignors
TSUMURA, TETSUYA
Executed: 2007-12-13
NISHIYAMA, HIROHARU
Executed: 2007-12-26
TSUJIMOTO, ETSUO
Executed: 2007-12-13
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Heat Dissipating Wiring Board, Method for Manufacturing Same, and Electric Device Using Heat Dissipating Wiring Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.