Patent Assignment
Reel/Frame 021169/0125
Assignment of Assignor's Interest
Recorded: 2008-06-30
Pages: 6
Assignors
ITO, HIROMI
Executed: 2008-05-22
KAMIMUTA, YUUICHI
Executed: 2008-05-21
WATANABE, YUKIMUNE
Executed: 2008-06-16
MIGITA, SHINJI
Executed: 2008-06-20
Assignees
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-0004, JAPAN
SEIKO EPSON CORPORATION
4-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0811, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device That Includes Forming Metal Oxide Film on Semiconductor Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.