Patent Assignment
Reel/Frame 021186/0802
Assignment of Assignor's Interest
Recorded: 2008-06-24
Pages: 2
Assignors
IKEGUCHI, NOBUYUKI
Executed: 2008-04-30
SOHN, KEUNGJIN
Executed: 2008-04-30
SHIN, JOONSIK
Executed: 2008-04-30
PARK, JUNG-HWAN
Executed: 2008-04-30
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Semiconductor Package and Semiconductor Plastic Package Using the Same