Patent Assignment
Reel/Frame 021222/0427
Assignment of Assignor's Interest
Recorded: 2008-07-10
Pages: 3
Assignors
KANG, SUN-WON
Executed: 2008-06-23
BAEK, SEUNG-DUK
Executed: 2008-06-23
LEE, JONG-JOO
Executed: 2008-06-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI,, GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Chip Stack Package