Assignment of Assignor's Interest

Recorded: 2008-06-27 Pages: 4

Assignor

ASAMI, SHIGERU

Executed: 2008-06-23

Assignee

TDK CORPORATION

1-13-1, NIHONBASHI, CHUO-KU, TOKYO 103-8272, JAPAN

Covered Property (1)

Electronic module and fabrication method thereof

Application: 12/216,043 →

Publication: US 2009/0002967

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.