Patent Assignment
Reel/Frame 021260/0420
Assignment of Assignor's Interest
Recorded: 2008-07-18
Pages: 2
Assignor
OHTA, HIRONORI
Executed: 2008-06-30
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO 108-8001, JAPAN
Covered Property
(1)
Semiconductor Device, Printed Wiring Board for Mounting the Semiconductor Device and Connecting Structure for These
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.