Patent Assignment
Reel/Frame 021287/0207
Assignment of Assignor's Interest
Recorded: 2008-07-10
Pages: 3
Assignors
PARK, JIN-HO
Executed: 2008-07-03
CHOI, GIL-HEYUN
Executed: 2008-07-03
LEE, SANG-WOO
Executed: 2008-07-03
LEE, HO-KI
Executed: 2008-07-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same