Patent Assignment
Reel/Frame 021299/0454
Assignment of Assignor's Interest
Recorded: 2008-07-28
Pages: 2
Assignors
SAKAI, TADAHIKO
Executed: 2008-05-12
EIFUKU, HIDEKI
Executed: 2008-05-12
MOTOMURA, KOUJI
Executed: 2008-05-12
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Electronic Components Mounting Adhesive, Manufacturing Method of an Electronic Components Mounting Adhesive, Electronic Components Mounted Structure, and Manufacturing Method of an Electronic Components Mounted Structure
Application:
12/096,446 →
Publication:
US 2009/0161328
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.