IP Library Assignment 021300/0196
Patent Assignment
Reel/Frame 021300/0196

Assignment of Assignor's Interest

Recorded: 2008-07-28 Pages: 4
Assignors
NISHINO, SHIGEO
Executed: 2008-06-20
TAKASAKA, HIROYUKI
Executed: 2008-06-20
MATSUO, NAGAYOSHI
Executed: 2008-06-20
OKABE, HIROYUKI
Executed: 2008-06-20
Assignee
HITACHI CABLE, LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Multilayer Wiring Board and Method of Making the Same
Patent: 8,178,191 →
Application: 12/138,779 →
Publication: US 2009/0151990
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jan 29, 2014
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 032134/0723 →