Patent Assignment
Reel/Frame 021306/0589
Assignment of Assignor's Interest
Recorded: 2008-07-29
Pages: 3
Assignors
KAWASHITA, MICHIHIRO
Executed: 2008-05-30
YOSHIMURA, YASUHIRO
Executed: 2008-06-02
TANAKA, NAOTAKA
Executed: 2008-05-30
NAITO, TAKAHIRO
Executed: 2008-06-17
AKAZAWA, TAKASHI
Executed: 2008-06-05
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-0004, JAPAN
Covered Property
(1)
Manufacturing Process and Structure of Through Silicon Via
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.