Assignment of Assignor's Interest

Recorded: 2008-07-24 Pages: 9

Assignors

YAMANAKA, TOSHIO

Executed: 2008-07-07

OKADA, KOJI

Executed: 2008-06-30

KOJIMA, KOHEI

Executed: 2008-06-25

NOJIRI, HITOSHI

Executed: 2008-07-02

Assignee

KANEKA CORPORATION

2-4, NAKANOSHIMA 3-CHOME, KITA-KU, OSAKA-SHI, OSAKA 530-8288, JAPAN

Covered Property (1)

Photosensitive Dry Film Resist, Printed Wiring Board Making Use of the Same, and Process for Producing Printed Wiring Board

Application: 12/223,196 →

Publication: US 2010/0218984

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.