Patent Assignment
Reel/Frame 021363/0874
Assignment of Assignor's Interest
Recorded: 2008-08-08
Pages: 5
Assignor
ABE, SATOSHI
Executed: 2008-07-30
Assignees
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU,, TOKYO, 100-0004, JAPAN
POWERCHIP SEMICONDUCTOR CORP.
NO. 12, LI-HSIN 1ST RD. HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device for Preventing Voids in the Contact Region and Method of Forming the Same.
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.