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Patent Assignment
Reel/Frame 021366/0210

Assignment of Assignor's Interest

Recorded: 2008-08-11 Pages: 2
Assignors
NAKAGAWA, HIDEO
Executed: 2006-12-08
SASAGO, MASARU
Executed: 2006-12-08
MURAKAMI, TOMOYASU
Executed: 2006-12-15
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Dry Etching Method, Fine Structure Formation Method, Mold and Mold Fabrication Method
Patent: 7,906,030 →
Application: 11/659,107 →
Publication: US 2009/0017259
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 11, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021818/0725 →
Assignment of Assignor's Interest May 27, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0917 →