Patent Assignment
Reel/Frame 021366/0288
Assignment of Assignor's Interest
Recorded: 2008-08-11
Pages: 2
Assignor
HIGASHITANI, HIDEKI
Executed: 2006-12-18
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Wiring Substrate, Wiring Material, Copper-Clad Laminate, and Method of Manufacturing the Wiring Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.