Patent Assignment
Reel/Frame 021402/0524
Assignment of Assignor's Interest
Recorded: 2008-08-18
Pages: 4
Assignors
LEE, YOUNG S.
Executed: 2008-07-14
RUI, YING
Executed: 2008-08-15
LUBOMIRSKY, DMITRY
Executed: 2008-07-14
HOFFMAN, DANIEL J.
Executed: 2008-08-15
YANG, JANG GYOO
Executed: 2008-07-14
WANG, ANCHUAN
Executed: 2008-07-14
Assignee
APPLIED MATERIALS, INC.
P.O. BOX 450A, LEGAL AFFAIRS DEPT., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
High Density Plasma Gapfill Deposition-Etch-Deposition Process Using Fluorocarbon Etchant