IP Library Assignment 021405/0773
Patent Assignment
Reel/Frame 021405/0773

Assignment of Assignor's Interest

Recorded: 2008-08-19 Pages: 4
Assignors
LEE, HUN SIK
Executed: 2008-06-24
LEE, CHANG HA
Executed: 2008-06-24
JUNG, HUN SANG
Executed: 2008-06-24
KIM, TAE HO
Executed: 2008-06-24
ROH, HYUNG SANG
Executed: 2008-06-24
Assignee
SAMSUNG CORNING PRECISION GLASS CO., LTD.
644-1 JINPYEONG-DONG, GUMI-SI, KYUNGSANGBUK-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property (1)
Glass Substrate Cutting Apparatus and Glass Substrate Cutting System Using the Same
Patent: 8,110,776 →
Application: 12/164,150 →
Publication: US 2009/0134135
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 6, 2010
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 024804/0238 →
Change of Name Jun 20, 2014
From: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
To: CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 033205/0584 →