Patent Assignment
Reel/Frame 021415/0503
Assignment of Assignor's Interest
Recorded: 2008-08-20
Received: 2008-08-20
Pages: 4
Assignors
CHUNG, JIN-KOO
Executed: 2008-08-12
LEE, JOO-HYEON
Executed: 2008-08-12
PARK, CHANG-MO
Executed: 2008-08-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN 3-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KRX, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus and Method for Forming Thin Film
Application:
11/937,237 →