IP Library Assignment 021458/0563
Patent Assignment
Reel/Frame 021458/0563

Assignment of Assignor's Interest

Recorded: 2008-08-28 Pages: 5
Assignors
CHANDRA, ADITI
Executed: 2008-08-19
KAMATH, ARVIND
Executed: 2008-08-19
CLEEVES, JAMES MONTAGUE
Executed: 2008-08-22
ROCKENBERGER, JOERG
Executed: 2008-08-15
TAKASHIMA, MAO
Executed: 2008-08-26
SCHER, ERIK
Executed: 2008-08-21
Assignee
KOVIO, INC.
233 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Methods of Making Metal Silicide Contacts, Interconnects, and/or Seed Layers
Patent: 8,158,518 →
Application: 12/175,450 →
Publication: US 2009/0020829
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jun 27, 2013
From: KOVIO, INC.
To: SQUARE 1 BANK
Reel/Frame 030706/0282 →
Assignment of Assignor's Interest Jan 27, 2014
From: KOVIO, INC.
To: THIN FILM ELECTRONICS ASA
Reel/Frame 032126/0931 →
Security Interest Jun 9, 2020
From: THIN FILM ELECTRONICS, INC.; THIN FILM ELECTRONICS, ASA
To: UTICA LEASECO, LLC
Reel/Frame 053472/0129 →
Change of Name Aug 22, 2022
From: THIN FILM ELECTRONICS ASA
To: ENSURGE MICROPOWER ASA
Reel/Frame 061298/0249 →