Patent Assignment
Reel/Frame 021479/0794
Assignment of Assignor's Interest
Recorded: 2008-09-04
Pages: 2
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-0004, JAPAN
Covered Property
(1)
Semiconductor Device Having Wiring Substrate Stacked on Another Wiring Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.