IP Library › Assignment 021486/0645
Patent Assignment
Reel/Frame 021486/0645

Assignment of Assignor's Interest

Recorded: 2008-09-05 Pages: 2
Assignors
TSUJIKAWA, TOSHIHIKO
Executed: 2008-03-14
UCHIYAMA, HIROSHI
Executed: 2008-03-14
YAMADA, AKIRA
Executed: 2008-03-14
IWAHASHI, TAKASHI
Executed: 2008-03-14
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Component Bonding Method and Component Bonding Device
Patent: 7,708,848 →
Application: 12/280,705 →
Publication: US 2009/0011676
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 6, 2009
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 022363/0306 →