Patent Assignment
Reel/Frame 021577/0045
Assignment of Assignor's Interest
Recorded: 2008-09-24
Pages: 4
Assignors
TANIGUCHI, YASUSHI
Executed: 2008-07-23
NAKATANI, SEIICHI
Executed: 2008-07-24
KARASHIMA, SEIJI
Executed: 2008-07-16
KITAE, TAKASHI
Executed: 2008-07-16
MATSUOKA, SUSUMU
Executed: 2008-07-16
KOYAMA, MASAYOSHI
Executed: 2008-07-16
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Bump Forming Method and Bump Forming Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.