IP Library › Assignment 021578/0880
Patent Assignment
Reel/Frame 021578/0880

Assignment of Assignor's Interest

Recorded: 2008-09-24 Pages: 2
Assignors
HAJI, HIROSHI
Executed: 2008-07-14
OZONO, MITSURU
Executed: 2008-07-14
KASAI, TERUAKI
Executed: 2008-07-14
NONOMURA, MASARU
Executed: 2008-07-14
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Component Bonding Method, Component Laminating Method and Bonded Component Structure
Patent: 8,614,118 →
Application: 12/280,615 →
Publication: US 2009/0035892
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 6, 2009
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 022363/0306 →