Patent Assignment
Reel/Frame 021586/0395
Assignment of Assignor's Interest
Recorded: 2008-09-25
Pages: 2
Assignor
HIGASHITANI, HIDEKI
Executed: 2008-06-27
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Multilayer Wiring Board and Its Manufacturing Method
Application:
12/279,890 →
Publication:
US 2010/0224395
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.