IP Library Assignment 021610/0430
Patent Assignment
Reel/Frame 021610/0430

Assignment of Assignor's Interest

Recorded: 2008-09-15 Pages: 3
Assignors
LOWRY, MICHAEL
Executed: 2008-09-09
BRAUER, ERIC A.
Executed: 2008-09-08
DEGENKOLB, THOMAS A.
Executed: 2008-09-09
WONG, VICTOR
Executed: 2008-09-09
Assignee
DELPHI TECHNOLOGIES, INC.
P.O. BOX 5052, LEGAL STAFF - MAIL CODE: 480-410-202, TROY, MICHIGAN, 48007-5052
Covered Property (1)
Leaded Semiconductor Power Module with Direct Bonding and Double Sided Cooling
Patent: 7,759,778 →
Application: 12/283,647 →
Publication: US 2010/0065950
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 23, 2018
From: DELPHI TECHNOLOGIES, INC.
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 045127/0546 →
Change of Name Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068985/0968 →