Patent Assignment
Reel/Frame 021635/0326
Assignment of Assignor's Interest
Recorded: 2008-10-06
Pages: 4
Assignors
KITAE, TAKASHI
Executed: 2008-07-28
NAKATANI, SEIICHI
Executed: 2008-07-28
KARASHIMA, SEIJI
Executed: 2008-07-28
SAWADA, SUSUMU
Executed: 2008-07-28
HOTEHAMA, KENICHI
Executed: 2008-07-28
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method
Application:
12/281,195 →
Publication:
US 2009/0008776
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.